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a datasheet btm510/511 multimedia module version 6.8 C specific to fw v22.2.5.0 note: for additional information on features and functionality of the btm510/511, refer to the user guide and other documents found on the laird embedded wireless support sites product page for this module.
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 2 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 r evision h istory version date notes approver 1.0 3/01/2012 initial release jonathan kaye 2.0 3/30/2012 updates and correct to firmware jonathan kaye 3.0 4/13/2012 v18.1.3.0 jonathan kaye 4.0 10/16/2012 general reformatting edits jonathan kaye 5.0 1/10/2013 fixed sear ch bug. jonathan kaye 6.0 3/22/2013 fixed general formatting and hyperlink issues jonathan kaye 6.1 13 jan 2014 update fcc and ic statements sue white 6.2 06 feb 2014 updated mechanical drawings jonathan kaye 6.3 20 feb 2014 updated docum ent for new fi rmware: v18.1.4.0/ btm51x - 08 jonathan kaye 6.4 15 dec 2014 separated document into two docs: hardware integration guide and user guide jonathan kaye 6.5 22 jan 2015 updated bluetooth sig qualification section jonathan kaye 6.6 08 jun 2015 removed usb d + and usb d - references jonathan kaye 6.7 15 nov 2015 changed usb references to uart andrew chen 6.8 0 8 feb 2017 f ixed module height andrew chen
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 3 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 c ontents 1 overview ................................ ................................ ................................ ................................ ............................ 4 features ................................ ................................ ................................ ................................ ................................ . 4 application areas ................................ ................................ ................................ ................................ .................... 4 2 specifications ................................ ................................ ................................ ................................ ...................... 5 2.1 detailed specifications ................................ ................................ ................................ ............................... 5 2.2 pin definitions ................................ ................................ ................................ ................................ ............ 6 2.3 operating parameters ................................ ................................ ................................ ................................ 9 2.4 voltage specifications ................................ ................................ ................................ ................................ 9 2.5 audio design requirements ................................ ................................ ................................ ....................... 9 2.5.1 speaker output ................................ ................................ ................................ ................................ 11 3 fcc regulatory statements ................................ ................................ ................................ ............................. 11 3.1 btm510 fcc and industry canada statements ................................ ................................ ....................... 11 3.1.1 considerations for oem integration: ................................ ................................ .............................. 11 3.1.2 fcc labelling requirement ................................ ................................ ................................ .............. 11 3.2 btm511 fcc and industry canada st atements ................................ ................................ ....................... 12 3.2.1 considerations for oem integration ................................ ................................ ............................... 12 3.2.2 fcc labelling requirement ................................ ................................ ................................ .............. 12 4 eu declaration of compliance ................................ ................................ ................................ ......................... 12 4.1 declaration of conformity C btm510 ................................ ................................ ................................ ...... 12 4.1.1 declaration ................................ ................................ ................................ ................................ ...... 13 4.2 declaration of conformity C btm511 ................................ ................................ ................................ ...... 13 4.2.1 declaration ................................ ................................ ................................ ................................ ...... 14 5 mechanical drawings ................................ ................................ ................................ ................................ ...... 15 5.1 btm510 mechanical drawings ................................ ................................ ................................ ................ 15 5.4 btm511 mechanical diagrams ................................ ................................ ................................ ................ 17 6 ordering information ................................ ................................ ................................ ................................ ...... 20 6.1 general comments ................................ ................................ ................................ ................................ .. 20 7 application note ................................ ................................ ................................ ................................ .............. 20 7.1 introduction ................................ ................................ ................................ ................................ ............. 20 7.2 shipping ................................ ................................ ................................ ................................ ................... 20 7.3 reflow parameters ................................ ................................ ................................ ................................ .. 21 8 bluetooth sig qualification ................................ ................................ ................................ ............................. 22 9 additional assistance ................................ ................................ ................................ ................................ ...... 23 10 related documents and files ................................ ................................ ................................ .......................... 23
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 4 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 1 o verview the btm510 and btm511 are low - power bluetooth? modules designed for adding robust audio and voice capabilities. based on the market - leading cambridge silicon radio bc05 chipset, these modules provide exceptionally low power consumpti on with outstanding range. supporting bluetooth v3.0 specification, these modules provide the important advantage of secure simple pairing that improves security and enhances easy use. at only 14 mm x 20 mm, the compact size of the btm510 is ideal for batt ery - powered or headset form factor audio and voice devices. with a 16 - bit stereo codec and microphone inputs to support both stereo and mono applications, these modules also contain a full, integrated bluetooth - qualified stack along with spp, hfp 1.6, hsp, avrcp v1.5, and a2dp profiles. the btm510/511 modules include an embedded 32 - bit, 64 - mips dsp core within the bc05. this is integrated with the bluetooth functionality which allows designers to add significant product enhancements including features such as echo cancellation, noise reduction, and audio enhancement using additional soft codecs. the availability of the 16mb of flash memory in the module allows complex functionality to be included. dsp routines can be licensed through a number of specialist partners. typical applications for these modules include bluetooth stereo headsets, voip phones, and wireless audio links. to speed product development and integration, laird technologies has developed a comprehensive at command interface that simplifies application development, including support for audio and headset functionality. access to gpio pins allows mapping for direct connection to actuator buttons on headsets. combined with a low - cost development kit, laird technologies bluetooth? modules provi de faster time to market. features ? fully featured bluetooth? multimedia module ? bluetooth? v3.0 (fw v22.2.5.0 onwards) ? supports mono and stereo headset applications ? adaptive frequency hopping to cope with interference from other wireless devices ? 32 - bit kalimba dsp for enhanced audio applications ? support for secure simple pairing ? external or internal antenna options ? hsp, hfp, a2dp, and avrcp audio profiles ? 16 - bit stereo codec and microphone input ? integrated audio amplifiers for driving stereo speaker ? com prehensive at interface for simple programming ? bluetooth end product qualified ? compact size ? class 2 output C 4 dbm ? low power operation ? wi - fi co - existence hardware support application areas ? high - quality stereo headsets ? mono voice headsets ? hands - free devices ? wireless audio cable replacement ? mp3 and music players ? phone accessories ? voip products ? cordless headsets ? automotive
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 5 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 2 s pecifications 2.1 detailed specifications table 1 : detailed specifications categories feature implementation wirele ss specification standards supported bluetooth ? v 3.0 transmit class class 2 frequency 2.402 C 2.480 ghz channels 79 channels frequency hopping adaptive frequency hopping maximum transmit power +4 dbm @ antenna pad C btm510 +4 dbmi from integrated antenna C btm511 minimum transmit power - 27 dbm @ antenna pad C btm510 - 27 dbmi from integrated antenna C btm511 receive sensitivity better than - 86 dbm data transfer rate up to 300 kbps range up to 30 meters antenna modes external antenna 50 o hm matched smt pad C btm510 integrated antenna +0 db multilayer ceramic C btm511 uart interface serial interface rs - 232 bi - directional for commands and data baud rate 16550 compatible bits configurable from 1,200 to 921,600 bps parity non - stand ard baud rates supported stop bits 8 default serial parameters odd, even, none levels 1 or 2 modem control 9600,n,8,1 general purpose interface i/o 4 general purpose i/o pins i2s stereo audio digital interface bus led 2 audio codec integrate d stereo codec with - 95 db snr for dac amplifiers direct drive for 16 speakers microphone input for low noise microphone sample rates (dac and adc) 8, 11.025, 16, 22.05, 32 & 44.1khz protocols and firmware bluetooth? stack v3.0 compliant. fully integrated. profiles gap generic access profile sdp service discovery profile spp serial port profile hsp C audio gateway and h eadset unit hfp v1.6 C audio gateway and handsfree a2dp C source and sink avrcp v1.5 C target and controller protocols rfcomm avctp avdtp
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 6 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 categories feature implementation command interface at instruction set comprehensive c ontrol of co nnection and module operation, including extensions for audio control. direct mapping of gpio to audio functions, e.g. play, volume, etc. s registers for non - volatile storage of parameters dsp kalimba dsp integrated in bc05 32bit, 64mips, 16 mbps flash memory (shared) applications available from partners current consumption data transfer typically < 35 ma stereo music typically < 70 ma (including speaker drive) low power sniff mode less than 1.5 ma supply voltage supply 3.0 v C 3.6 v dc i/o 1.7 v C 3.6 v dc uart 1.7 v C 3.6 v dc coexistence / compatibility wlan (802.11) 2 - wire and 3 - wire hardware coexistence schemes supported connections external antenna (option) pad for 50 ohm antenna C btm510 interface surface mount pads physical dimensions 14.0 mm x 20.0 mm x 2.9 mm - btm510 14.0 mm x 25.0 mm x 2.9 mm - btm511 weight 3 grams environmental operating temperature - 40 c to +85 c storage temperature - 40 c to +85 c approvals bluetooth? qualified as an end product fcc limited modular approval C btm510 modular approval (integrated antenna C btm511) mic (japan) previously telec ce and r&tte meets ce and r&tte requirements miscellaneous lead free lead - free within eu requirements and rohs compliant warranty 1 - year warranty development tools development kit development board and software tools 2.2 pin definitions table 2 : pin definitions pin signal description voltage specification 1 gpio_8 / dtr host i/o vio 2 gpio_5 / bt_state / bt_pr iority host i/o, bt co - existence vio 3 pcm_in pcm data i/p vio 4 pcm_out pcm data o/p vio 5 pcm_sync pcm sync i/p vio 6 pcm_clk pcm clk i/p vio 7 led_ext1 host i/o see note 2 8 led_ext0 host i/o see n ote 2 9 gnd 10 vdd_u art uart supply voltage 11 vdd_io i/o supply voltage
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 7 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 pin signal description voltage specification 12 vdd_in main supply voltage 13 gnd 14 spi_csb spi bus chip select i/p vio 15 spi_miso spi bus serial o/p vio 16 spi_clk spi bus clock i/p vio 17 spi_mosi spi bus se rial i/p vio 18 gpio_3 / dsr host i/o vio 19 gpio_4 / ri host i/o vio 20 gpio_2 / dcd host i/o vio 21 gpio_1 / bt_active host i/o, bt co - existence vio 22 gnd 23 audio_gnd audio ground 24 spkr_a_n speaker, channel a - (left) see audio design requirements 25 spkr_a_p speaker, channel a+ (left) see audio design requirements 26 spkr_b_n speaker, channel b - (right) see audio design requirements 27 spkr_b_p speaker, channel b+ (right) see audio design requirements 28 mic_bias microphone bias see audio design requirements 29 mic_bp_c microphone, channel b+ (right) see audio design requirements 30 mic_bn_c microphone, channel b - (right) see audio design requirements 31 mic_ap_c micro phone, channel a+ (left) see audio design requirements 32 mic_an_c microphone, channel a - (left) see audio design requirements 33 unused 34 ant antenna connect ion C btm510 only (50 ohm matched) 35 unused 36 unused 37 unused 38 unused 39 unused 40 unused 41 unused 42 unused 43 unused 44 unused 45 unused 46 unused 47 gnd 48 uart_rts request to send o/p vusb 49 uart_cts cl ear to send i/p vusb 50 uart_tx transmit data o/p vusb 51 uart_rx receive data i/p vusb 52 gpio_7 / rf_active host i/o, bt co - existence vio 53 gpio_6 / wlan_active host i/o, bt co - existence vio 54 reset module reset i/p see not e 1
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 8 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 note: 1. reset input is active low. input is pulled up to vdd_in via 22 k. minimum reset pulse width is 5 ms. 2. led drive pins are open drain outputs, so the external circuit to the right should be used. the voltage on the module pad should be maintained below 0.5 v in which case the ron of the fet is around 20 . if this condition is met, the current flowing through the diode is as follows: where vf is the forward bias voltage of the led. figure 1 : microphone mode the inpu t impedance on the microphone inputs (in microphone mode) is typically 6k. the audio input is designed for use with inputs of between 1 a and 10 a at 94 db spl. if the biasing resistors are set to 1 k, this implies a microphone with sensitivity in the range - 40 dbv to - 60 dbv. the low pass filter elements formed by the inductor and capacitor are necessary to eliminate rf pick up on the microphone inputs and should be placed as close to the module as possible. when operating in line input mode, the inpu t can be connected directly to the module input pins in either single or double ended configuration as follows: figure 2 : line input mode
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 9 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 2.3 operating parameters table 3 : operating parameters recommended oper ating conditions operating condition min max vdd_uart 1.7 3.6 vdd_io 1.7 3.3 vdd_in 3.0 3.6 2.4 voltage specifications table 4 : voltage specifications (vuart) logic levels ( vuart ) input voltage levels min typical max vih 0.7 vdd _uart vil - 0.4 +0.8 o utput v oltage l evels voh (iout = - 4ma) vdd_uart C 0.4 vol (iout = 4ma) 0 0.4 table 5 : voltage specifications (vio) logic levels (vio ) i nput v oltage l evels m in t ypical m ax v ih 0. 625 vdd_uart vdd_io +0.3 v il - 0. 3 0.25vdd_io output voltage levels v oh (iout = - 4ma) 0.75vdd_io vdd_io v ol (iout = 4ma) 0 0.125 notes for pcb layout: 1. the rf output pin must match to a 50 strip - line or coplanar waveguide on the btm510 (no antenna) . 2. ensure there are no exposed conductors under the module to avoid shorts to the module test points. 3. the pcb footprint is provided for guidance only. users may wish to modify the pcb land dimensions to suit their specific manufacturing or process. 2.5 audio design requirements t he audio inputs of the btm510/511 can operate in either line input mode or microphone mode. the input circuit has a two stage amplifier C the first stage provides a fixed 24 db gain and the second a variable gain of between - 3 db and 18 db. if an input gai n of less than 24 db is selected, then the first stage is switched out and the module is operating in line input mode. the btm511 can support both single - ended and fully differential stereo line input ( figure 3 ).
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 10 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 figure 3 : single and double ended line inputs a 15nh / 15pf low pass filter must be added to each input line and placed as close to the btm511 input pins as possible . otherwise the bt envelope may be demodulated, causing audio ar tifacts in the 800 C 1600khz range that cannot be removed. i f using single - ended line input, it is only necessary to fit one low pass filter per channe l. for both stereo line in and microphone modes, you may connect the input signal to either the positive or negative side of the input. t he unused input should be connected to either mic_bias or agnd (note: the adk - btm511 - v04 design fits one low pass filter on each of the 4 channel inputs). the left channel (mic_ap_c / mic_an_c) should be used as the standar d mono channel, the right channel inputs (mic_bp_c / mic_bn_c) can be used as an auxiliary mono channel or connected to agnd if unused (remember to fit the low pass filter on one or both of the unused right channel inputs). a typical line input signal has a voltage of 1.75vrms or 5vpk - pk . h owever, the btm511 can only tolerate 0.4vrms on the audio inputs. a r esistive network can be used to divide the input signal down to 0.4vrms if necessary. the audio inputs can operate in either line input mode or microp hone mode. the input circuit has a two stage amplifier C the first stage provides a fixed 24 db gain and the second a variable gain of between - 3 db and 18 db. if an input gain of less than 24 db is selected, then the first stage is switched out and the mo dule is operating in line input mode. when operating in microphone mode the mi crophone should be biased as shown in figure 4 . figure 4 : microphone biasing for microphone mode
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 11 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 the input impedance on the microphone inputs (in microphone mode) is typically 6k . the audio input is designed for use with inputs of between 1 a and 10 a at 94 db spl. if the biasing resistors are set to 1 k , this implies a microphone with sensitivity in the ra nge - 40 dbv to - 60 dbv. 2.5.1 speaker output the speaker output is capable of driving loads with a minimum impedance of 16 directly. 3 fcc r egulatory s tatements 3.1 btm510 fcc and industry canada statements the final equipment user manual must show the following sta tements: this device complies with part 15 of the fcc rules. operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that ma y cause undesired operation. changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the equipment. to comply with the fcc rf exposure compliance requirements, this device and its a ntenna must not be co - located or operating to conjunction with any other antenna or transmitter. 3.1.1 considerations for oem integration: this module has a limited modular approval. approval with any other antenna configuration or layout other than that approve d will necessitate additional radiated emission testing to be performed. to inherit the modular approval, the antennas for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co - located or operating in conjunction with any other antenna or transmitter. this module was approved with the following antenna: rf solutions: ant - 24g - whj - sma 0 dbi operation of this module with any other antenna will require additional testing to be performed. co - location with other radio transmitting devices operating concurrently in the same band will require additional testing and certification. designers should note the distinction that the fcc makes regarding portable and mobile devices. mobile devices are de fined as products that are not used closer than 20cm to the human body, whereas portable devices can be used closer that 20cm to the body. a device may be used in portable exposure conditions with no restrictions on host platforms when the averaged output power is less than the low power threshold for an uncontrolled environment 60/f (ghz) i.e. 25 mw for a 2.4 ghz device. the maximum power exposure for the btm510 has been evaluated and found to comply with the low power threshold for an uncontrolled environment. refer to fcc document kdb 447498 for more information on rf exposur e procedures and equipment authorization policies for mobile and portable devices. 3.1.2 fcc labelling r equirement if the fcc id is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. this exterior label can
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 12 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 use wording such as the following: contains transmitter module fcc id: pi4510b or contains fcc id: pi4510b. any similar wording that expresses the same meaning may be u sed. 3.2 btm511 fcc and industry canada statements the user manual must show the following statements: this device complies with part 15 of the fcc rules. operation is subject to the following two conditions: (1) this device may not cause harmful interference , and (2) this device must accept any interference received, including interference that may cause undesired operation. changes or modifications not expressly approved by the party responsible for compliance could void the users authority to operate the e quipment. to comply with the fcc rf exposure compliance requirements, this device and its antenna must not be co - located or operating to conjunction with any other antenna or transmitter. 3.2.1 consideration s for oem in tegration to inherit the modular approval, the antennas for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co - located or operating in conjunction with any other antenna or transmitter. co - location with other radio transmitting devices operating concurrently in the same band requires additional testing and certification. designers should note the distinction that the fcc makes regarding portable and mobile devices. mobile devices are defined as products that are not used closer t han 20cm to the human body, whereas portable devices can be used closer that 20cm to the body. a device may be used in portable exposure conditions with no restrictions on host platforms when the averaged output power is less than the low power threshold f or an uncontrolled environment 60/f (ghz) i.e. 25 mw for a 2.4 ghz device. the maximum power exposure for the btm511 has been evaluated and found to comply with the low power threshold for an uncontrolled environment. refer to fcc document kdb 447498 for more information on rf exposure procedures and equipment authorization policies for mobile and portable devices. 3.2.2 fcc labelling requirement if the fcc id is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. this exterior label can use wording such as the following: contains transmitter module fcc id: pi4511b or contains fcc id: pi4511b. any similar wording that expr esses the same meaning may be used. 4 eu d eclaration of c ompliance 4.1 declaration of conformity C btm510 manufacturer: laird technologies product: btm 510 eu directive: rtte 1995/5/ec
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 13 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 reference standards used for presumption of conformity: article # require ment reference standard(s): 3.1a health and safety iec 60950 - 1:2005 (2nd ed); +am 1:2009 +am2:2013; en 60950 - 1: 2006+a11+a1:2010+a12:2011+a2:2013 3.1b protection requirements with respect to electromagnetic compatibility en 301 489 - 1 v1.9.2 (2011 - 09) e n 301 489 - 17 v2.2.1 (2012 - 09) emissions: en55022:2010 /ac:2011, class b immunity: en61000 - 4 - 2:2009 en61000 - 4 - 3:2006 /a1:2008/a2:2010 3.2 means of the efficient use of the radio frequency spectrum en 300 328 v1.8.1 (2012 - 06) 4.1.1 declaration we, laird technolo gies, declare under our sole responsibility that the essential radio test suites have been carried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of article 3 of the eu direc tive 1995/5/ec, when used for its intended purpose. place of issue: laird 11160 thompson ave. lenexa, ks 66219 usa date of issue: february 2015 name of authorized person: daniel waters/certifications specialist signature: 4.2 declaration of conformity C btm511 manufacturer: laird technologies product: btm511 eu directive: rtte 1995/5/ec
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 14 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 reference standards used for presumption of conformity: article # requirement reference standard(s): 3.1a health and safety iec 60950 - 1:2005 (2nd ed); +am 1:2009 + am2:2013; en 60950 - 1: 2006+a11+a1:2010+a12:2011+a2:2013 3.1b protection requirements with respect to electromagnetic compatibility en 301 489 - 1 v1.9.2 (2011 - 09) en 301 489 - 17 v2.2.1 (2012 - 09) emissions: en55022:2010 /ac:2011, class b immunity: en61000 - 4 - 2:2009 en61000 - 4 - 3:2006 /a1:2008/a2:2010 3.2 means of the efficient use of the radio frequency spectrum en 300 328 v1.8.1 (2012 - 06) 4.2.1 declaration we, laird technologies , declare under our sole responsibility that the essential radio test suites have been c arried out and that the above product to which this declaration relates is in conformity with all the applicable essential requirements of article 3 of the eu directive 1995/5/ec, when used for its intended purpose. place of issue: laird 11160 thompson ave . lenexa, ks 66219 usa date of issue: february 2015 name of authorized person: daniel waters/certifications specialist signature:
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 15 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 5 m echanical d rawings 5.1 btm510 mechanical drawings notes: an area of 1.5 mm around the module should be reserved as a keep - out area. the development kit schematics for thi s product can be accessed from the following link: development kit schematics C btm510
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 16 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 5.2 btm510 mechanical diagrams note: an area of 1.5 mm around the module should be reserved as a keep - out area. the development kit schematics for this product can be accessed on the software downloads tab of the btm51x pr oduct page . 5.3 btm510 mechanical diagrams warning: test point dimensions are for reference only. do not make electrical connections to these test points. this voids the warranty. laird does not recommend routing on the top layer underneath the module.
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 17 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 5.4 btm 511 mechanical diagrams note: an area of 1.5 mm around the mod ule should be reserved as a keep - out area. the development kit schematics for this product can be accessed on the software downloads tab of the btm51x product page .
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 18 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 5.5 btm511 mechanical diagrams note: an area of 1.5 mm around the module should be reserved as a keep - out area. the development kit schematics for this product can be accessed on the software downloads tab of the btm51x product page .
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 19 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 5.6 btm511 mechanical diagrams 5.7 btm511 mechanical diagrams warning: test point dimensions are for reference only. do not make electrical connections to these test points. this voids the warranty. laird does not recommend routing on the top layer underneath the module.
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 20 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 6 o rdering i nformation part n umber description btm 510 bluetooth? multimedia module (external antenna) btm 511 bluetooth? multimedia module with integrated antenna dvk C btm 510 development board with btm510 soldered in plac e dvk C btm 511 development board with btm511 soldered in place 6.1 general comments refer to the schematic btv - r - 003.pdf for the development kit on the following two pages for examples of typical pin connections. a pdf of the schematic can be downloaded f rom the product web page. 7 a pplication n ote 7.1 introduction laird technologies surface mount modules are designed to conform to all major manufacturing guidelines. this application note provides additional guidance beyond the information that is presented in t he users manual. this application note is a living document and is updated as new information is presented. the modules are designed to meet the needs of many commercial and industrial applications . the modules are designed to be easily manufactured and conform to current automated manufacturing processes. 7.2 shipping modules are shipped in esd (electrostatic discharge) safe trays that can be loaded into most manufacturers pick and place machines. layouts of the trays are provided in figure 5 . figure 5 : btm510 and btm511 shipping tray detail 1 . 0 1 0 0 . 8 0 4 0 . 2 0 2 0 . 8 1 3 0 . 7 0 7 0 . 1 7 6 0 . 6 0 2 0 . 6 0 2 d e t a i l b d e t a i l a d e t a i l a r 0 . 0 5 0 d e t a i l b r 0 . 5 0 8 8 . 0 p o c k e t w a l l a n g l e s t o p a n d b o t t o m r a d i u s r = 0 . 0 2 5 " 0 . 5 4 5 0 . 7 4 9 1 . 3 5 1 1 . 5 5 5 1 . 6 4 5 2 . 7 4 5 3 . 8 4 5 4 . 9 4 5 6 . 0 4 5 7 . 1 4 5 8 . 2 4 5 9 . 3 4 5 1 0 . 4 4 5 1 2 . 0 0 0 0 . 3 1 3 0 . 1 5 6 + 0 . 0 - 0 . 0 1 0 0 . 4 1 9 0 . 5 2 4 1 . 1 2 6 1 . 2 3 1 1 . 3 1 9 2 . 2 1 9 3 . 1 1 9 4 . 0 1 9 0 , 0 0 , 0 5 . 2 5 0 l a i r d - 5 2 0 0 - 0 0 0 2 1 n o t e s : 1 ) m a t e r i a l m u s t b e c a p a b l e o f d i s c h a r g i n g a n e l e c t r o - s t a t i c c h a r g e ( e s d ) , a n d s y m b o l m u s t b e l o c a t e d a s s h o w n . 2 ) l a i r d p a r t n u m b e r m u s t b e e m b o s s e d i n t o t h e c a r r i e r a t t h i s l o c a t i o n . 3 ) e x t e r i o r e d g e s m a y b e m o d i f i e d t o a l l o w f o r s t a m p i n g t r a y , a s l o n g a s o u t s i d e m a x i m u m d i m e n s i o n i s n o t e x c e e d e d . 4 ) d i m e n s i o n s : a l l d i m e n s i o n s a r e i n i n c h e s ( u n l e s s o t h e r w i s e s h o w n ) 5 ) t o l e r a n c e s : x . x x + / - 0 . 0 1 0 x . x x x + / - 0 . 0 0 5 a n g l e s + / - 1 d e g r e e ( u n l e s s o t h e r w i s e s h o w n ) 3 1 2 t e l e m a t i c s - l e n e x a t i t l e d w g . n o . r e v d r a w n b y b t m 5 1 0 / 1 1 v o i c e s h i p p i n g t r a y 5 2 0 0 - 0 0 0 2 1 1 d r k s h e e t 1 / 1 d a t e 8 - 1 0 - 0 9 9 2 . 0 p o c k e t c o r n e r d e t a i l b t m 5 1 1 b t m 5 1 0 0 . 7 8 7 0 . 9 8 4 0 . 5 5 1 0 . 5 5 1 r e f e r e n c e a s s e m b l i e s 0 . 1 4 3 0 . 1 4 3 r a d i u s a c c e p t a b l e ( 0 . 2 5 " m a x i m u m )
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 21 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 7.3 reflow parameters laird surface mount modules are designed to be easily manufactured including reflow soldering to a pcb. it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. lairds surface mount modules conform to j - std - 020d1 standards for reflow temperatures. im portant: during reflow, modules should not be above 260 and not for more than 30 seconds. figure 6 : recommended reflow temperature temperatures should not exceed the minimums or maximums presented in table 7 - 1 : recommended m aximum and minimum temperatures . table 7 - 1 : recommended m aximum and minimum temperatures specification value unit temperature inc./dec. rate (max) 3 c / sec temperatu re decrease rate (goal) 2 - 3 c / sec soak temp increase rate (goal) .5 - 1 c / sec flux soak period (m in) 60 sec flux soak period (m ax) 90 sec flux soak temp (mi n) 150 c flux soak temp (max) 190 c time above liquidous (max) 60 sec time above liqu idous (min) 20 sec time in target reflow range (goal) 30 sec time at absolute peak (max) 30 sec liquidous temperature (sac305) 217 c lower target reflow temperature 225 c upper target reflow temperature 250 c absolute peak temperature 260 c target profile soak min soak max liquidous lower target upper target absolute peak
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 22 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 8 b lue tooth sig q ualification the btm510 and btm511 modules are listed on the bluetooth sig website as qualified end products. design name owner declaration id link to listing on the sig website btm510, btm511 laird d023160 https://www.bluetooth.org/tpg/qli_viewqdl.cfm?qid=23160 it is a mandatory requirement of the bluetooth special interest group (sig) that every product implementing bluetooth technology has a declaration id. every blueto oth design is required to go through the qualification process, even when referencing a bluetooth design that already has its own declaration id. the qualification process requires each company to registered as a member of the bluetooth sig C www.bluetooth.org the following link provides a link to the bluetooth registration page: https://www.bluetooth.org/login/register/ for each bluetooth design it is nece ssary to purchase a declaration id. this can be done before starting the new qualification, either through invoicing or credit card payment. the fees for the declaration id will depend on your membership status, please refer to the following webpage: https://www.bluetooth.org/en - us/test - qualification/qualification - overview/fees for a detailed procedure of how to obtain a new declaration id for your design, please refer to the following sig document: https://www.bluetooth.org/docman/handlers/downloaddoc.ashx?doc_id=283698&vid=317486 to start the listing, go to: https://www.bluetooth.org/tpg/qli_sdoc.cfm . in step 1, select the option, reference a qualified design and enter 16227 in the end product table entry. you can then select your pre - paid declaration id f rom the drop down menu or go to the purchase declaration id page, (please note that unless the declaration id is pre - paid or purchased with a credit card, it will not be possible to proceed until the sig invoice is paid. once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help document. your new design will be listed on the sig website and you can print your certificate and doc. for further information please refer to the f ollowing training material: https://www.bluetooth.org/en - us/test - qualification/qualification - overview/listing - process - updates
btm510/511 multimedia module datasheet embedded wireless solutions support center: http://ews - support.lairdtech.com www.lairdt ech.com/ramp 23 ? copyright 201 7 laird. all rights reserved americas: +1 - 800 - 492 - 2320 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 9 a dditional a ss istance please contact your local sales representative or our support team for further assistance: laird connectivity products business unit support centre: http://ews - support.lairdtech.com email: wireless.support@lairdtech.com phone: americas: +1 - 800 - 492 - 2320 option 2 europe: +44 - 1628 - 858 - 940 hong kong: +852 2923 0610 web: http://www.lairdtech.com/ bluetooth 10 r elated d ocuments and f iles the following additional btm510/511 technical documents are also available from the laird btm51x series product page of the embedded wireless support site under the documentation tab: ? btm510/511 product brief ? btm510/511 user manual firmware ? btm510/511 firmware files ? b tm510/511 firmware release notes - version 18.1.4.0 development kit schematics ? btm510 development kit schematics ? btm511 development kit schematics ? btm511 development kit schematics - version 4 development kit documentation ? btm511 development kit quick st art a2dp and avrcp - version 2 ? btm511 development kit quick start hfp - version 2 ? btm511 development kit quick start spp - version 2 ? btm511 audio development kit (adk) user manual - version 4 the following download are also available from the laird btm51x series product page: ? laird (ezurio) terminal v6.9.0.zip

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